High-precision Automatic SAC Alignment System

Our company’s independently developed High-precision Automatic SAC Alignment System (Model: OA9000-SAC) is designed for automated production of slow-axis collimators in array semiconductor fiber-coupled pump lasers. This system revolutionizes the traditional production process, which is almost exclusively reliant on manual operation in the industry, by automating the assembly of slow-axis collimators for semiconductor lasers. This results in a significant increase in production efficiency while ensuring consistency in product quality. The small size and short back focal length of SAC slow-axis collimators make manual assembly difficult, prone to damaging semiconductor chips, and inefficient. However, our automated system addresses these issues perfectly.

This system comprises a motion unit, automatic dispensing unit, imaging unit, control unit, and programmable control software. The core motion unit features Japanese imported motors with high accuracy and long service life, ensuring long-term stable operation of the system. The combination of efficient image algorithms, our unique control technology, and dispensing design ensures that the system’s comprehensive performance is comparable to that of imported equipment from abroad.

The operation time for a single channel SAC (excluding curing)

The system enables automatic chip powering, image recognition for SAC retrieval, automatic SAC micro-adjustment, dispensing and curing, as well as automatic data saving to the customer’s database;
The SAC pick-and-place tooling is equipped with a vacuum sensor that automatically stops and alerts if SAC cannot be picked up;
The equipment is compatible with multiple products, and the spacing and height of each channel can be adjusted as required;

Far-field and near-field difference

The system is capable of automatically and sequentially coupling all SACs for a single product as required by the manufacturing process, while ensuring that the customer’s chips are protected from any contact or damage during the movement process;
After automatically powering the chips, the system performs micro-adjustment on the SACs based on parameters displayed on the spotter machine, such as spot size, length, and position;
Adhesive can be dispensed at the bottom of the SACs, based on their specific positions;

Linear slide resolution

After the chips have been cured using UV, the system can automatically power them up again to check the size and position of the cured SAC spots;
The system then automatically adjusts the position of the base, lowers the electrical probe, and picks up the next SAC for the next automatic coupling process;
The automated program can be paused and resumed at any time, allowing customers to interrupt the program for other operations during use;

Rotary slide resolution

Uniform distribution of dispensing, with dispensing length adjustable within 3-9mm;
The system provides the flexibility to select any optical path for coupling, rather than being restricted to a fixed sequence (from SAC-1 to SAC-N), which enables customers to perform rework coupling of a specific optical path’s SAC as required during use;

Name	High-precision Automatic SAC Alignment System
Model	OA9000-SAC
Pressure range	0.6 ± 0.1 MPa
Rated voltage	220V / 16A
Rated Power	1.8 KW
Power supply	(198~242) VAC，50Hz
Vacuum source	-0.07Mpa
Network	Cat5/6
Outline dimension	W800xD1000xH1685mm (excluding the expanded portion of the observation window and the display)
Weight	300kg
Operating environment	Avoid high temperatures and ensure good lighting in the working area Do not expose the equipment to moisture and do not use it in workshops without adequate rain protection measures For indoor use only
Equipment structural requirements	The equipment’s structural layout should be reasonable, with no interference between modules, and with sufficient clearance
Other requirements	① The equipment’s design and manufacturing should feature advanced mechanical structure, process manufacturing, control systems, and user-friendly design, while ensuring safe operation ② The necessary standard configuration for the equipment’s normal use must be complete and matching, including all corresponding accessories, cables, tools, and spare parts

S/N	Name	Remarks
1	Near-field CCD	After CCD calibration and identification of the beam spot, the SAC is bonded and cured with the selected optimal spot
2	Dispensing cylinder	The precise dispensing process is carried out smoothly with the help of the Japanese SMC pneumatic slide table
3	Dual cameras	To ensure the accuracy of the system, two cameras, a pick-up camera, and a dispensing camera, are used to monitor the pick-up and dispensing status in real-time
4	Automatic dispensing device	For dispensing
5	SAC pick-and-place tooling	A clamping lens with an accompanying sensor is utilized to ensure the highest level of clamping accuracy
6	The power-on components	Real-time adjustments to the position of the chips are made using a manual displacement stage for precise alignment
7	Light guide arm	A set of optical path refraction system is formed by combining precision prism with machined parts to achieve high accuracy
8	X axis	Travel: 300mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm}
9	Y axis	Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm}
10	Z axis	Travel: 50mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm}
11	CX axis	Travel: 200mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm}
12	CY axis	Travel: 20mm Resolution: {Full: 0.2μm, Half: 0.1μm}
13	CZ axis	Travel: 100mm Resolution: {Full: 2μm, Half: 1μm}
14	θY (Yaw axis)	Travel: ±8°, Repeated positioning accuracy: within ±0.005°