Automatic Focusing Mirror Alignment System

Our company’s independently developed Automatic Focusing Mirror Alignment System (Model: OA19000-FLA) is designed for the automated production process of focusing mirror coupling for array semiconductor pumped lasers. The system can achieve the automatic assembly of the fast-axis focusing mirror, slow-axis focusing mirror, and reflector in a single system. The system’s functions mainly include automatic material loading, dispensing, alignment, fine-tuning of coupling, data saving, uploading to customer databases, and automatic alarm, among others.
The system is compatible with multiple control cards and uses customized image acquisition modules, which can simultaneously assemble multiple materials and quickly complete the coupling of multiple light paths. Compared with traditional manual bonding processes, the system has higher product accuracy and controllable consistency.

Coupling time (excluding UV)

Far-field and near-field difference
Name | Automatic Focusing Mirror Alignment System |
Model | OA19000-FLA |
Pressure range | 0.6 ± 0.1 MPa |
Rated voltage | 220V / 16A |
Rated Power | 1.8 KW |
Power supply | (198~242) VAC,50Hz |
Vacuum source | -0.07Mpa |
Network | Cat5/6 |
Outline dimension | W1300xD850xH1800mm (excluding the expanded portion of the observation window and the display) |
Weight | 550kg |
Operating environment | Avoid high temperatures and ensure good lighting in the working area Do not expose the equipment to moisture and do not use it in workshops without adequate rain protection measures For indoor use only |
Equipment structural requirements | The equipment’s structural layout should be reasonable, with no interference between modules, and with sufficient clearance |
Other requirements | ① The equipment’s design and manufacturing should feature advanced mechanical structure, process manufacturing, control systems, and user-friendly design, while ensuring safe operation ② The necessary standard configuration for the equipment’s normal use must be complete and matching, including all corresponding accessories, cables, tools, and spare parts |

S/N | Name | Remarks |
1 | Far-field and Near-field Spot Profiler | Retrieve optical characteristic parameters of the beam spot and perform micro-adjustments on the fast-axis focusing mirror, slow-axis focusing mirror, and reflector mirror |
2 | Dispensing cylinder | Utilizing a Japanese SMC pneumatic slide table for dispensing on three material sets |
3 | Material handling fixture | Collecting the fast-axis focusing mirror, slow-axis focusing mirror, reflector mirror, and accompanying sensors to ensure the accuracy of the pick-up |
4 | UV curing | To cure the glue with the UV rod |
5 | Automatic Feeder | Providing an automatic feeding function |
6 | Storage locations for modules | Designed for storing modules, with the left side dedicated to semi-finished products and the right side for finished products |
7 | Automatic loading and unloading fixture | Used for picking up and placing pump source modules |
8 | F_X axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
9 | F_Y axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
10 | F_Z axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
11 | F_Yaw axis | Travel: ±8°, Repeated positioning accuracy: within ±0.005° |
12 | F_Pitch axis | Travel: ±4°, Repeated positioning accuracy: ±0.001° |
13 | S_X axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
14 | S_Y axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
15 | S_Z axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
16 | S_Yaw axis | Travel: ±8°, Repeated positioning accuracy: within ±0.005° |
17 | S_Pitch axis | Travel: ±4°, Repeated positioning accuracy: ±0.001° |
18 | M_X axis | Travel: 50mm Resolution: {Full/Half: 4μm/2μm, Microstep (1/20 Microstepping) 0.2μm} |
19 | M_Y axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
20 | M_Z axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
21 | M_Yaw axis | Travel: ±6°, Repeated positioning accuracy: within ±0.005° |
22 | M_Pitch axis | Travel: ±4°, Repeated positioning accuracy: ±0.001° |
23 | CX axis | Travel: 300mm Resolution: {Full/Half: 4μm/2μm, Microstep (1/20 Microstepping) 0.2μm} |
24 | CY axis | Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm} |
25 | MAT_X axis | Travel: 500mm, Positioning repeatability: ±0.005mm, Rated Torque: 0.64/1.27 |
26 | MAT_Y axis | Travel: 200mm, Positioning repeatability: ±0.005mm, Rated Torque: 0.64/1.27 |
