Automatic FAC Alignment System

Our company’s independently developed Automatic FAC Alignment System (Model: OA9000-PLF) is designed for automated production of fast-axis collimator mirrors for arrayed semiconductor fiber-coupled pump lasers. The system automates collimator mirror assembly, replacing the traditional manual production mode, which is still prevalent in the industry, leading to a significant increase in production efficiency while ensuring consistency in product specifications. The small size and ultra-short micrometer-level back focal length of the Fast Axis Collimator (FAC) collimator mirror make manual assembly extremely challenging and increase the likelihood of semiconductor chip damage. Our automation system provides an optimal solution to this practical problem.

This system comprises a motion unit, automatic dispensing unit, imaging unit, control unit, and programmable control software. The core motion unit features Japanese imported motors with high accuracy and long service life, ensuring long-term stable operation of the system. The combination of efficient image algorithms, our unique control technology, and dispensing design ensures that the system’s comprehensive performance is comparable to that of imported equipment from abroad.

FAC operation time for a single channel (excluding curing)

The system offers automated chip powering, image recognition for FAC picking, auto-FAC micro-adjustment, automated dispensing and curing, and saving of customer data to their respective databases;
The FAC pick-up fixture is equipped with a vacuum sensor that automatically triggers an alarm and stop when the fixture fails to pick up the FAC;
The equipment is compatible with multiple products, and the spacing and height of each channel can be adjusted as required;

Far-field and near-field difference

The system offers continuous, automated coupling of all the FACs for at least one product in a specified order, as per the process requirements, while ensuring that the customer chips are not touched or damaged during the movement process;
After automatically powering up the chips, the system automatically fine-tunes the FACs based on parameters such as spot size, width, and position displayed on the spot machine;

Linear slide resolution

During dispensing, adhesive can be applied to both sides of the FAC based on its position without contaminating the chip’s light-emitting area;
After the UV curing process, the chips are powered up again to verify the size and location of the cured spots on the FACs;
The system automatically adjusts the position of the base, lowers the power probes, and picks up the next FAC for automated coupling of the succeeding set of FACs;

Rotary slide resolution

The automated program can be paused and resumed at any time, allowing customers to interrupt the program for other operations during use;
Customers have the flexibility to choose any desired optical path for coupling, rather than being restricted to a predetermined sequence (from FAC1 to FACN), allowing them to rework and couple a specific optical path FAC as needed during use.

Name	Automatic FAC Alignment System
Model	OA9000 – PLF
Pressure range	0.6 ± 0.1 MPa
Rated voltage	220V / 16A
Rated Power	1.8 KW
Power supply	(198~242) VAC，50Hz
Vacuum source	-0.07Mpa
Network	Cat5/6
Outline dimension	W800xD1000xH1685mm (excluding the expanded portion of the observation window and the display)
Weight	300kg
Operating environment	Avoid high temperatures and ensure good lighting in the working area Do not expose the equipment to moisture and do not use it in workshops without adequate rain protection measures For indoor use only
Equipment structural requirements	The equipment’s structural layout should be reasonable, with no interference between modules, and with sufficient clearance
Other requirements	① The equipment’s design and manufacturing should feature advanced mechanical structure, process manufacturing, control systems, and user-friendly design, while ensuring safe operation ② The necessary standard configuration for the equipment’s normal use must be complete and matching, including all corresponding accessories, cables, tools, and spare parts

S/N	Name	Remarks
1	Far/Near-field CCD	By precisely calibrating double CCDs to recognize the spot, the system accurately identifies the optimal location of the light and uses it to cure the adhesive at the FAC with precision and efficiency
2	Dispensing cylinder	The precise dispensing process is carried out smoothly with the help of the Japanese SMC pneumatic slide table
3	Dual cameras	To ensure the accuracy of the system, two cameras, a pick-up camera, and a dispensing camera, are used to monitor the pick-up and dispensing status in real-time
4	Light guide arm	A set of optical path refraction system is formed by combining precision prism with machined parts to achieve high accuracy
5	FAC pick-up fixture	A clamping lens with an accompanying sensor is utilized to ensure the highest level of clamping accuracy
6	The power-on components	Real-time adjustments to the position of the chips are made using a manual displacement stage for precise alignment
7	X axis	Travel: 300mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm}
8	Y axis	Travel: 30mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm}
9	Z axis	Travel: 50mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm}
10	CX axis	Travel: 200mm Resolution: {Full/Half: 2μm/1μm, Microstep (1/20 Microstepping) 0.1μm}
11	CY axis	Travel: 20mm Resolution: {Full: 0.2μm, Half: 0.1μm}
12	CZ axis	Travel: 100mm Resolution: {Full: 2μm, Half: 1μm}
13	θX (Pitch axis)	Travel: ±4°, Repeated positioning accuracy: ±0.001°
14	θY (Yaw axis)	Travel: ±8°, Repeated positioning accuracy: within ±0.005°
15	θZ (Roll axis)	Travel: ±4°, Repeated positioning accuracy: ±0.001°